225689-E - TE Connectivity

Description: Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Contact Features: Contact Type Socket | Contact Mating Area Plating Material Thickness 2 – 6 MICM | Contact Underplating Material Thickness 39.37 – 118.11 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 78.74 – 236.22 MICIN | Contact Current Rating (Max) 120 AMP | Contact Mating Area Plating Material Tin (Sn) | Contact Mating Area Plating Material Finish Matte | C