226537-1 - TE Connectivity
Description: Body Features: Shell Base Material Brass | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Beryllium Copper | Contact Mating Retention Without | Contact Type Pin | Contact Orientation Straight | Electrical Characteristics: Impedance Options Non-Matched | Operation/Application: Circuit Application Power & Signal | Other: Dielectric Material TPX | Packaging Features: Packaging Method Carton | Product Type Features: C