227602-2 - TE Connectivity

Description: Body Features: Shell Base Material Beryllium Copper | Shell Plating Material Gold | Configuration Features: Number of Positions 1 | Contact Features: Contact Mating Area Plating Material Thickness 50 MICIN | Contact Orientation Right Angle | Contact Mating Area Plating Material Gold | Contact Mating Retention Without | Contact Current Rating (Max) 1 AMP | Contact Type Pin | Dimensions: PCB Thickness (Recommended) .125 INCH | PCB Thickness (Recommended) 3.18 MM | Electrical Characteristics: Impedance Options