2324787-1 - TE Connectivity
Description: Configuration Features: Number of Positions 74 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .9 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .0