2325864-2 - TE Connectivity

Description: Configuration Features: Number of Positions 40 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Tail Plating Material Tin | Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 56 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline