2327670-3 - TE Connectivity

Description: Configuration Features: Number of Positions 140 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitc