2327677-9 - TE Connectivity

Description: Configuration Features: Number of Positions 140 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch)