2327678-1 - TE Connectivity
Description: Configuration Features: Number of Positions 84 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitch