2327678-2 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 84 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc