2327678-9 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 84 | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc