2332141-4 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | Number of Positions 56 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 1.1 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .0