2332141-5 - TE Connectivity

Description: Configuration Features: Number of Positions 56 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 1.1 AMP | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc