2332205-9 - TE Connectivity

Description: Configuration Features: Number of Positions 140 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .762 MICM | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Housing Features: Centerline (Pitch) .023 INCH | Centerline (