2359366-1 - TE Connectivity

Description: Configuration Features: Number of Positions 74 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 1 AMP | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .02