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2360189-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 124 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1 AMP | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .0

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