2361493-2 - TE Connectivity

Description: Body Features: Bus Bar Contact Plating Material Silver | Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Mating & Unmating Configuration Normal | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 3 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Shape & Form Multiple Contact Band/CROWN BAND | Contact Mating Area Plating Material Thickness 120 MICIN | Contact Underplating Material Thickness 50 MICIN | Cont