2384218-2 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 168 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 3 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .076 MICIN | Housing Features: Centerline (Pitch) .026 INCH | Centerline (Pitc