3-5331677-4 - TE Connectivity
Description: Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Material Gold | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Spring Plating Thickness .762 MICM | Contact Spring Plating Thickness 30 MICIN | Dimensions: PCB Hole Diameter