Description: Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating M