Description: Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Ma