350211-1 - TE Connectivity

Description: Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Cont