350219-1 - TE Connectivity
Description: Configuration Features: Number of Positions 10 | Number of Power Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Curren