350430-4 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating