350561-2 - TE Connectivity
Description: Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter 2.13 MM | Contact Retention Within Housing With | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 30 MICIN | Contact Current Rating (Max) 19 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Wire C