350712-1 - TE Connectivity

Description: Configuration Features: Number of Positions 9 | Number of Rows 3 | PCB Mount Orientation Vertical | Number of Power Positions 9 | Contact Features: Contact Layout Matrix | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Type Pin | Contact Current Rating (Max) 10 AMP | PCB Contact Termination Area Pl