350713-1 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 3 | Number of Power Positions 12 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Ho