350763-4 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 9 | Number of Positions 9 | Number of Rows 3 | Contact Features: Contact Retention Within Housing Without | Contact Layout Matrix | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 15 AMP | Contact Type Socket | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Underplating Material Thickness 1.27 MICM | Multiple Contact Types W