350764-4 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 3 | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Layout Matrix | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Type Socket | PCB Contact Ter