350786-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Layout Inline | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Conta