Description: Configuration Features: Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Conta