350792-3 - TE Connectivity

Description: Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Current Rating (Max) 19 AMP | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material T