350824-1 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Type Socket | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Underplating Ma