350826-4 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Type Socket | Contact Current Rating (Ma