350835-4 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 9 | Number of Rows 3 | Number of Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Layout Matrix | Contact Type Socket | Contact Mating Area Plating M