Description: Configuration Features: Number of Positions 12 | Number of Power Positions 12 | PCB Mount Orientation Vertical | Number of Rows 3 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area