Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Number of Signal Positions 0 | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 39.37 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 3 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 1 MICM | Housing Features: Hous