Description: Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.8 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Ho