Description: Configuration Features: Number of Positions 10 | PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area P