5050863-8 - TE Connectivity
Description: Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Tin | Contact Current Rating (Max) 4 AMP | Contact Base Material Beryllium Copper | Contact Spring Plating Thickness 2.54 MICM | Dimensions: Wire Size .081 – .326 MMSQ | PCB Hole Diameter 1.32 MM | PCB Thickness (