5050871-8 - TE Connectivity
Description: Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Current Rating (Max) 7.5 AMP | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .031 – .125 INCH | PCB Thickness (Recommen