50863 - TE Connectivity

Description: Body Features: Sleeve Plating Material Gold Flash over Nickel | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Gold | Contact Base Material Beryllium Copper | Contact Spring Plating Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICM | Dimensions