50864 - TE Connectivity

Description: Body Features: Sleeve Material Copper | Sleeve Plating Material Gold Flash over Nickel | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) 5 AMP | Contact Spring Plating Thickness .762 MICM | Contact Spring Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Thickness 30 MICIN | Dimensions