5645951-1 - TE Connectivity

Description: Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICM | Contact Spring Plating Material Tin | Contact Base Material Beryllium Copper | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: Wire Size .162 –