5645952-2 - TE Connectivity

Description: Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Material Gold | Contact Spring Plating Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICM | Dimensions: PCB Thickness (Re