Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Signal Positions 0 | Number of Power Positions 6 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 39.37 MICIN | Contact Current Rating (Max) 3 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Housing Features: Cent