60888-2 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Terminal Type Receptacle | Mating Pin Diameter .058 INCH | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Terminal Plating Material Gold | Mating Pin Diameter 1.47 MM | Terminal Orientation Straight | Dimensions: Terminal Material Thickness .25 MM | Compatible Insulation Diameter (Max) .065 INCH | Compatible Insulation Diameter Range .89 – 1.65 MM | PCB Hole Diameter 3.18 MM |