61668-1 - TE Connectivity
Description: Contact Features: Contact Orientation Straight | PCB Contact Termination Area Plating Material Thickness 2.032 – 5.08 MICM | Contact Type Hermaphroditic | PCB Contact Termination Area Plating Material Thickness 80 – 200 MICIN | Contact Mating Area Plating Material Tin-Lead | Contact Mating Area Plating Material Thickness 2.032 – 5.08 MICM | PCB Contact Termination Area Plating Material Tin-Lead | Contact Underplating Material Nickel | Contact Current Rating (Max) 6 AMP | Contact Base Material Brass |