61668-4 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Thickness 30 MICIN | Contact Orientation Straight | PCB Contact Termination Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | PCB Contact Termination Area Plating Material Nickel | Contact Current Rating (Max) 6 AMP | Contact Type Hermaphroditic | Dimen