63066-1 - TE Connectivity

Description: Contact Features: Contact Underplating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Terminal Plating Material Tin | Mating Tab Width 6.35 MM | PCB Terminal Type Tab | Terminal Orientation Straight | Contact Underplating Material Thickness 100 MICIN | Contact Underplating Material Brass | Contact Mating Area Plating Material Thickness 3.81 MICM | Terminal Size 6.35 | Mating Tab Thickness