Description: Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Mating Post Length 10.16 MM | PCB Contact